Title:
処理表面の調整および温度制御のための方法ならびに装置
Document Type and Number:
Japanese Patent JP2005514789
Kind Code:
A
Abstract:
Methods and apparatus for controlling the temperature of a process surface and for conditioning of a process surface are provided. In one example, a temperature controller is described within a CMP system. The CMP system has a first roller and a second roller and a linear belt circulating around the first and second rollers. The linear belt has a width that spans between a first edge and a second edge. The temperature controller includes an array of thermal elements. Each of the thermal elements of the array is independently controlled. The array of thermal elements is positioned between the first roller and the second roller and configured to contact a back surface of the linear belt. The array of thermal elements extends between the first edge and the second edge of the linear belt width.
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Inventors:
Knee Emil A.
Application Number:
JP2003558910A
Publication Date:
May 19, 2005
Filing Date:
December 26, 2002
Export Citation:
Assignee:
LAM RESEARCH CORPORATION
International Classes:
B24B21/04; B24B49/14; B24B53/007; B24B53/017; B24B53/047; H01L21/304; H01L21/306; (IPC1-7): H01L21/304; B24B37/00; B24B37/04
Attorney, Agent or Firm:
Meisei International Patent Office