Title:
プリント基板に実装を行うための方法、プリント基板に実装を行うためのシステム、および、コンピュータプログラム
Document Type and Number:
Japanese Patent JP6448786
Kind Code:
B2
Abstract:
To populate printed circuit boards by means of a pick-and-place line, multiple set-ups, each having an associated set-up family, are formed. A number of component types is associated with each set-up and a number of printed circuit board types is associated with each associated setup family, such that a printed circuit board of a printed circuit board type in a set-up family can be populated on the pick-and-place line using components of the component types associated with the set-up. A setting-up table comprising a stock of components of a component type in a set-up can be provided on the pick-and-place line. A method for populating the printed circuit boards includes the steps of recording printed circuit board types, from which printed circuit boards are to be populated with components of associated component types, and associating recorded printed circuit board types with set-up families.
Inventors:
Alexander pfa finger
Christian royer
Christian royer
Application Number:
JP2017525616A
Publication Date:
January 09, 2019
Filing Date:
October 02, 2015
Export Citation:
Assignee:
Siemens Aktiengesellschaft
International Classes:
H05K13/00
Domestic Patent References:
| JP2006171916A | ||||
| JP2006012946A | ||||
| JP2009071137A | ||||
| JP4246897A |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
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