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Title:
銅表面に対する表面還元、不動態化、腐食防止、および活性化のための方法
Document Type and Number:
Japanese Patent JP5153143
Kind Code:
B2
Abstract:
A system and method of passivating an exposed conductive material includes placing a substrate in a process chamber and injecting a hydrogen species into the process chamber. A hydrogen species plasma is formed in the process chamber. A surface layer species is reduced from a top surface of the substrate is reduced. The reduced surface layer species are purged from the process chamber.

Inventors:
Bailey Andrew Di. The Third
Rojocare shrikanto pee.
Application Number:
JP2006551095A
Publication Date:
February 27, 2013
Filing Date:
December 30, 2004
Export Citation:
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Assignee:
LAM RESEARCH CORPORATION
International Classes:
C23G5/00; H01L21/3205; H01J37/32; H01L21/00; H01L21/302; H01L21/321; H01L21/3213; H01L21/44; H01L21/461; H01L21/4763; H01L21/768; H01L23/48; H01L23/52; H01L23/532; H01L29/24; H01L29/40; H01L33/00
Domestic Patent References:
JP2002507059A
JP2003506866A
JP2000114368A
JP2002231722A
JP11087353A
JP8017804A
JP6306648A
Attorney, Agent or Firm:
Meisei International Patent Office