Title:
MIC MODULE
Document Type and Number:
Japanese Patent JPH01179397
Kind Code:
A
Abstract:
PURPOSE:To simplify assembly operation, by a structure wherein a first board having a microwave integrated circuit pattern and a second board having a circuit pattern which is connected to the microwave integrated circuit pattern of the first substrate are integrated each other by a flexible printed-wiring board. CONSTITUTION:In a flexible printed-wiring board 11 having a pattern which is formed on a board made of polyimide by a copper foil or the like, a first board 12 having a microwave integrated circuit pattern and a second board 13 having a circuit pattern which is connected to the microwave integrated circuit pattern of the first board 12 are integrated each other so that the first and second boards 12, 13 are disposed to oppose each other through a partition board 1a in a case 1. The first board 12 out of the both boards of the flexible printed-wiring board 11 is held by a dielectric board 14. The assembly of a MIC module can be performed by bending back the flexible printed-wiring board 11 in the case 1. Accordingly, no wire rod 6 which connects between the circuit patterns of the boards 12, 13 located on both sides of the partition board 1a is necessary for the assembly of the module.
Inventors:
KAWAKAMI YOICHI
Application Number:
JP83088A
Publication Date:
July 17, 1989
Filing Date:
January 06, 1988
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K1/14; H05K7/02; H05K7/14; (IPC1-7): H05K1/14; H05K7/02; H05K7/14
Attorney, Agent or Firm:
Masuo Oiwa (2 outside)