Title:
マイクロチップ基板の接合方法およびマイクロチップ
Document Type and Number:
Japanese Patent JP4367055
Kind Code:
B2
Inventors:
Susumu Arai
Application Number:
JP2003307800A
Publication Date:
November 18, 2009
Filing Date:
August 29, 2003
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
B29C65/16; G01N31/20; B23K26/00; B23K26/32; G01N37/00; B29K23/00; B29L24/00
Domestic Patent References:
| JP2003043052A | ||||
| JP2003240755A | ||||
| JP2001191412A | ||||
| JP2000039420A | ||||
| JP2002243734A |