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Title:
MICROELECTRONIC CONTACT STRUCTURAL BODY LITHOROGRAPHICALLY DEMARCATED
Document Type and Number:
Japanese Patent JP2003031289
Kind Code:
A
Abstract:

To provide improved technology to manufacture a spring contact element.

A microelectronic contact structural body is lithographically demarcated by applying a substrate 202 such as an electronic component, preparing an opening 222 on its mask layer 220, depositing the conductive trace of a seed layer 250 on the mask layer and in the opening, and building a mass of a conductive material on the conductive trace. The sidewall of the opening may be inclined. The conductive trace can be patterned by depositing a material through the stencil or a shadow mask 240. A protruding fixture 230 can be disposed on the mask layer so that the tip part of the contact structural body obtains topology. Plural elastic contact structural bodies precisely positioned can be formed by entirely composing these components as a group.


Inventors:
PEDERSEN DAVID V
KHANDROS IGOR Y
Application Number:
JP2002152167A
Publication Date:
January 31, 2003
Filing Date:
May 14, 1998
Export Citation:
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Assignee:
FORMFACTOR INC
International Classes:
H01L23/12; H01L21/20; H01L21/3205; H01L21/48; H01L21/60; H01L23/48; H01L23/498; H01L23/52; H01L23/522; H01R4/48; H01R12/16; H01R13/24; H05K3/40; (IPC1-7): H01R13/24; H01R4/48; H01R12/16
Attorney, Agent or Firm:
Kaoru Furuya (2 outside)