Title:
一体化薄膜インダクタを含むマイクロモジュール及びその製造方法
Document Type and Number:
Japanese Patent JP2011513952
Kind Code:
A
Abstract:
Micromodules and methods of making them are disclosed. An exemplary micromodule includes a substrate having a thin film inductor, and a bumped die mounted on the substrate and over the thin film inductor.
Inventors:
Caroborante Francesco
Hawks Douglas Alan
Hawks Douglas Alan
Application Number:
JP2010547863A
Publication Date:
April 28, 2011
Filing Date:
February 25, 2009
Export Citation:
Assignee:
Fairchild Semiconductor Corporation
International Classes:
H01L23/12; H01L21/60; H01L23/14; H01L25/00
Attorney, Agent or Firm:
Motohiko Fujimura
Shigeyuki Nagaoka
Shigeyuki Nagaoka