MIRROR CHAMFERING APPARATUS FOR SEMICONDUCTOR WAFER OUTER PERIPHERY

Title:

MIRROR CHAMFERING APPARATUS FOR SEMICONDUCTOR WAFER OUTER PERIPHERY

Document Type and Number:

Japanese Patent JP2003175446

Kind Code:

A

Abstract:

To provide a mirror chamfering apparatus for a semiconductor wafer outer periphery, capable of simultaneously mirror-chamfering the outer periphery frontmost section of a semiconductor wafer.

This chamfering apparatus mirror-chamfers a chamfered section on the outer periphery of the disc-shaped semiconductor wafer 23A by rotating a polishing bed 4 which has a recessed polishing surface and a polishing member 5 fitted on the polishing surface by a driving means 11, pressing the chamfered section against the polishing member, and giving relative rotation to it. At least part of the polishing member 5 is deformed by load for pressing the chamfered section against the member 5, thus attaining such high flexibility that the outer periphery front end section 23' of the semiconductor wafer is partially dented into the polishing member.

Inventors:

TAKAHASHI SHUZO
NAGAHAMA TAMOTSU
HIRABAYASHI YASUO

Application Number:

JP2002331752A

Publication Date:

June 24, 2003

Filing Date:

June 25, 1997

Export Citation:

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Assignee:

NITMAC ER CO LTD
POBAALE KOGYO KK
KYOKUEI KENMA CO LTD

International Classes:

B24B9/00; H01L21/304; (IPC1-7): B24B9/00; H01L21/304

Attorney, Agent or Firm:

Kazuo Shigenobu (1 person outside)

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