To provide a resin composition for a laminate board, a prepreg laminate board and a wiring board which all can suppress radiation of unwanted electromagnetic waves.

The modified polyimide resin composition is provided which contains (A) a polymaleimide compound represented by general formula [1] (wherein R1 is a k-valent organic group; Xa and Xb are each a monovalent atom or group, which may be identical or different, selected from a hydrogen atom, halogen atom and organic group; and k is an integer of ≥2), (B) a curing agent, (C) an epoxy compound, and (D) an electric wave absorption material. Also provided are a prepreg which is obtained by impregnating into a base material a varnish obtained by dissolving the above resin composition in a solvent and drying; a laminate board which is formed by laminating a single or a plurality of pieces of this prepreg; a laminate board which is formed by laminating a metal foil or a metal plate on one side or both sides of the outermost layer so as to form a unified body; and a wiring board using the laminate board in an electric source layer.