Title:
モジュール式インイヤ型デバイス
Document Type and Number:
Japanese Patent JP7176674
Kind Code:
B2
Abstract:
An in-ear device includes a molding shaped to hold the in-ear device in an ear, and an audio package configured to emit sound. The audio package is structured to removably attach to the molding. An electronics package is structured to removably couple to the audio package and removably attach to the molding. The electronics package includes a controller to control the sound output from the audio package.
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Inventors:
Lugoro, Jason
Application Number:
JP2021520559A
Publication Date:
November 22, 2022
Filing Date:
October 23, 2019
Export Citation:
Assignee:
Aiyo Incorporated
International Classes:
H04R1/10
Domestic Patent References:
| JP2018019306A | ||||
| JP2015173369A |
Foreign References:
| US20150201269 | ||||
| US20080279409 | ||||
| CN207200920U |
Attorney, Agent or Firm:
Patent Attorney Corporation RYUKA International Patent Office