Title:
MODULE BOARD
Document Type and Number:
Japanese Patent JPH0750498
Kind Code:
A
Abstract:
PURPOSE: To improve electric characteristics and stability characteristics by avoiding separation of the shield conductor of a shield layer with regard to a multilayered board where high-density patterns are formed.
CONSTITUTION: Through-holes 23a, 23b formed in contact terminals 25 arrayed in a high density are arrayed in a stagger form so that shield conductors 22 may be interposed in the clearances of the through-holes 23a, 23b in a shield layer 212.
Inventors:
OCHIAI TATSUYA
IMAMURA KAZUYUKI
IMAMURA KAZUYUKI
Application Number:
JP19627393A
Publication Date:
February 21, 1995
Filing Date:
August 06, 1993
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H05K1/02; H05K1/11; H05K3/46; H05K9/00; H05K3/42; (IPC1-7): H05K9/00; H05K1/02; H05K1/11; H05K3/46
Attorney, Agent or Firm:
Tadahiko Ito
Next Patent: SHIELD FOR FLEXIBLE PRINTED WIRING BOARD