To control the oscillation frequency of a module having a piezoelectric vibrator piece by providing such electronic parts as a piezoelectric device and the LSI chips, on the upper or lower surface side of the package of a pin grid array or on both sides of a substrate.

A substrate 1 serves as a package that is called a pin grid array and is made of a laminated ceramic material. Many pins 2 are provided on the lower side of the substrate 1, and the upper side of the substrate 1 includes a recess part 5 where such parts as a piezoelectric device 3, the LSI chips 4, etc., are placed, a conduction pattern which is electrically connected to the input/output terminals of the chips 4, etc., a part where the device 3 is fixed, a conduction pattern which is electrically connected to the device 3, etc. In such a constitution of a module, the resonance frequency of the device 3 is measured in a state equivalent to a vibrator where only the device 3 is fixed on the substrate 1 before the chips 4 are mounted. Then the oscillation frequency can be controlled at a desired level after the chips 4 are mounted.