Title:
MODULE FOR NON-CONTACT IC CARD AND NON-CONTACT IC CARD USING THE SAME
Document Type and Number:
Japanese Patent JP2001256458
Kind Code:
A
Abstract:
To provide a module for a non-contact IC card which is thin, smooth, inexpensive and also highly strong without providing a reinforcing plate, and a non-contact IC card using the module for a non-contact IC card.
An IC 104 is provided on one surface of an insulation resin plate 101 provided with conductor foil 102 where a pattern is worked only on the other surface and with a connection hole 108 connecting the bump 105 of the IC to the conductor foil, and the bump of the IC is connected to the conductor foil in the connection hole to be mounted. The module for a non- contact IC card is used.
Inventors:
KOBAYASHI KAZUO
SAKATA NAOYUKI
SAKATA NAOYUKI
Application Number:
JP2000068556A
Publication Date:
September 21, 2001
Filing Date:
March 13, 2000
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
B42D25/455; B42D25/305; B42D25/46; G06K19/07; G06K19/077; (IPC1-7): G06K19/07; B42D15/10; G06K19/077
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