PURPOSE: To enhance the area efficiency in the mounting of components on a circuit board and formation of wiring pattern thereon, and to realize a highly reliable module.

CONSTITUTION: A bonding margin 11 for protective case is provided on the component mounting face of a printed wiring board 10, a through hole 12 is made in the region of the bonding margin 11, and a conductor land 13 connected with the through hole 12 is formed on the rear surface of the printed wiring board 10. A lead 22 is secured in a protective case 21 while being aligned with the through hole 12 thus constituting a protective case 20 molded integrally with the lead. When the protective case 20 integrated with lead is jointed to the printed wiring board 10, each lead 22 is passed through a corresponding through hole 12, the protective case 21 is bonded to the bonding margin 11 through an Si adhesive, and then the lead 22 and the conductor land 13 are soldered.