Title:
MOISTURE-CONDITIONING BOARD
Document Type and Number:
Japanese Patent JP2006027996
Kind Code:
A
Abstract:
To provide a lightweight moisture-conditioning board where problems such that a specific gravity becomes high and cracks arise from a large bending for a moisture-conditioning building material are solved.
The moisture-conditioning board is composed of a composite comprising an organic fiber porous body, slaked lime or calcium carbonate obtained by the carbonation reaction present in the pores of the organic fiber porous body, and a mixture comprising inorganic powders such as an inorganic porous powder, an inorganic waste powder, and calcium carbonate or the like as a filler.
Inventors:
KONDOU YOSHIHITO
WATABE HIROSHI
WATABE HIROSHI
Application Number:
JP2004237779A
Publication Date:
February 02, 2006
Filing Date:
July 21, 2004
Export Citation:
Assignee:
KAGAWA PREFECTURE
International Classes:
C04B28/12; B28B11/24; C04B14/04; C04B14/08; C04B16/06; C04B18/08; C04B18/16; C04B40/02; E04B1/64
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