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Title:
MOISTURE-CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2012167210
Kind Code:
A
Abstract:

To provide a moisture-curable resin composition excellent in transparency, rapid curability, adhesion and storage stability.

The moisture-curable resin composition comprises: (A) 100 pts.mass of a mixture of a polyoxyalkylene having a hydrolyzable silyl group and a (meth)acrylic polymer having a hydrolyzable silyl group; (B) 1-100 pts.mass of hydrophobic silica; (C) 1-15 pts.mass of a Michael addition reaction product between an amino group-containing alkoxysilane compound and a (meth)acrylic group-containing compound; and (D) 0.1-10 pts.mass of a curing catalyst.


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Inventors:
IKEDA AKIO
TSURUTA MAMORU
Application Number:
JP2011029909A
Publication Date:
September 06, 2012
Filing Date:
February 15, 2011
Export Citation:
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Assignee:
YOKOHAMA RUBBER CO LTD
International Classes:
C08L33/04; C08K3/36; C08K5/3435; C08K5/544; C08K5/57; C09J11/04; C09J11/06; C09J133/04; C09J171/02
Domestic Patent References:
JPH06322220A1994-11-22
JP2007023255A2007-02-01
JP2004292606A2004-10-21
JP2009524721A2009-07-02
JPH0688017A1994-03-29
JP2000038560A2000-02-08
JP2004277751A2004-10-07
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa
Hideaki Ito
Fumio Mitsuhashi



 
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