To solve the following problem: since the curing of an adhesive, a sealing material, or the like of a moisture-curing type proceeds by sucking internal moisture, moisture of an adherend, external moisture, or the like, the curing time becomes long when the adherend is a nonporous material containing no water, such as a metal or a tile, and a deep part does not cure when the coating thickness is thick.

The moisture-curing resin composition is prepared by compounding a modified silicone polymer having alkoxysilyl groups at its terminals with a curing catalyst and zeolite and can be cured quickly by expelling water adsorbed in zeolite to the outside by microwave induction heating or high-frequency induction heating. Therefore, even when the adherend is a nonporous one containing no water or even when the coating thickness is thick, the composition can be quickly cured, enabling work such as adhesion or sealing to be quickly done.