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Title:
MOISTUREPROOF PACKING FOR SHIPPING OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH04173570
Kind Code:
A
Abstract:

PURPOSE: To prevent moisture absorption of a semiconductor device from happening during storage, regardless of a using quantity of the shipping tube at one time by constituting the packing in such a manner that each small quantity of semiconductor devices, which are sealed, have moistureproof function.

CONSTITUTION: Since a semiconductor device is sealed by a sealing part 4 for each shipping tube 1, when a user uses the semiconductor device, only a necessary quantity is cut off from a perforation, and a moistureproof bag 3 is opened, and therefore, the remaining semiconductors can be stored until they are used in a moistureproof packing for shipping. The same effect can be obtained even under a pallet or other shipping form. Since the moistureproof packing for shipping has moistureproof function for each small quantity of semiconductors, problems concerning reliability of the semiconductor device can be prevented from generating, regardless of a using quantity of a user.


Inventors:
SAWADA KOKICHI
AKASAKA SUMIO
HATA TSUTOMU
Application Number:
JP30154790A
Publication Date:
June 22, 1992
Filing Date:
November 06, 1990
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B65D85/86; B65D75/42; B65D81/26; B65D85/00; B65D85/38; (IPC1-7): B65D75/42; B65D81/26; B65D85/00; B65D85/38
Attorney, Agent or Firm:
Masuo Oiwa (2 outside)