Title:
MOLD ASSEMBLY FOR MOLDING RESIN SEALING SECTION OF ELECTRONIC PART
Document Type and Number:
Japanese Patent JP3028873
Kind Code:
B2
Abstract:
PURPOSE: To prevent an obstruction by an upward ejector pin at the time of the cleaning of a mold, and to reduce mold clamping force required.
CONSTITUTION: In an upward ejector mechanism 41 installed on the top force 1 side, an upward ejector pin 25 is driven apart from the opening and closing of molds 1, 2. That is, upward knockout plates 23, 24 are energized downward by ejecting springs 27 while being lifted and driven by a hydraulic cylinder device 42. Accordingly, a return pin is unnecessitated. When the molds are cleaned, the upward ejector pin 25 is pulled in under the state of mold opening.
Inventors:
Masaki Maruyama
Victory Kanda
Hiroo Usui
Victory Kanda
Hiroo Usui
Application Number:
JP27155691A
Publication Date:
April 04, 2000
Filing Date:
October 19, 1991
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
B29C45/02; B29C45/14; B29C45/26; B29C45/40; H01L21/56; B29L31/34; (IPC1-7): B29C45/26; B29C45/40
Domestic Patent References:
| JP5559918A | ||||
| JP259309A | ||||
| JP54101860A |
Attorney, Agent or Firm:
Ushiki Mamoru (1 person outside)
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