Title:
MOLD INFORMATION MANAGING SYSTEM
Document Type and Number:
Japanese Patent JP2018128876
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a mold information managing system capable of preventing a system structure for information management from increasing in size and becoming complex as a device unit, and suitably applicable to an IoT.SOLUTION: A mold information managing system includes: identifier providing means provided for each mold and providing an identifier that uniquely specifies the mold; a sensor group including multiple sensors attached to the mold; an amplifier unit attached to the mold one on one, collecting individual detection values from the respective sensors in the sensor group, and creating sensor data of a record; and a gateway which wirelessly receives the sensor data of a record from the amplifier unit and relays the received sensor data of a record to a network.SELECTED DRAWING: Figure 1
Inventors:
IRINO KOICHI
Application Number:
JP2017021728A
Publication Date:
August 16, 2018
Filing Date:
February 08, 2017
Export Citation:
Assignee:
MEISHIN SEIKO KK
International Classes:
G05B19/418; G06Q50/04
Attorney, Agent or Firm:
Masayuki Manda