MOLD FOR MANUFACTURING METAL-CERAMIC COMPLEX SUBSTRATE

Japanese Patent JP3837680

B2

PROBLEM TO BE SOLVED: To manufacture a complex substrate excellent in thermal conductivity in a low cost by simultaneously forming a metallic circuit on the one side surface of a ceramic part and a heat radiating part integrating a heat radiating plate or a fin part having thinner than the metal thickness of the circuit formation on the reverse side surface by pouring molten aluminum or molten aluminum alloy after interposing the ceramic member with molds mutually fitted.
SOLUTION: On the one side inner surface of the fitting type parting molds, a molten metal pouring cylinder fixed part 4 molten metal introducing part 5, recessed part for fixing ceramic member 6, recessed part for circuit surface 6', feeder head part 7 and gas venting hole 8 are arranged. On the other side mold surface reversed to the one side, the molten metal pouring fixed part, molten metal introducing part, heat radiating plate part and feeder head part are arranged. After fixing the ceramic member having about 0.6mm thickness into the recessed part for fixing 6 as the ceramic member and a molten metal pouring cylinder to the fixed part 4, both molds are integrated and the molten metal is poured and cooled under formation of temp. gradient. By this constitution, the circuit forming surface having about 0.5mm thickness and the heat radiating plate having about 0.3mm thickness, are obtd.

JPS5785560	MANUFACTURE OF ROTOR
JP2019065315	SINTERED COMPONENT FOR INTERNAL CHILL AND LIGHT-METAL COMPOSITE MATERIAL

Bath Masahiro
Takashi Qianmori
Mitsuhiro Kosaka

JP13797397A

October 25, 2006

May 14, 1997

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DOWA MINING CO.,LTD.

B22D19/00; C04B37/02; C04B41/88; (IPC1-7): B22D19/00

JP8215828A
JP63199061A
JP60115358A
JP56065937U
JP57206561A
JP58053368A
JP51028528A

Seiichi Sawaki
Kiichi Sawaki

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