To provide a resin composition for encapsulating a semiconductor excellent in mold release restorability restoring mold release even when used in a small amount, causing no oil exudation and stain on the surface of a semiconductor device molded just after restoring mold release and maintaining the mold releasability for long period of time.

This mold release restoring resin composition for encapsulating semiconductors is characterized by containing (A) an epoxy resin, (B) a phenol rein-based curing agent, (C) a curing accelerator, (D) an inorganic filler, (E) a carboxy group-containing butadiene-acrylonitrile copolymer (e1) and/or a reaction product (e2) of a carboxy group-containing butadiene-acrylonitrile copolymer (e1) and an epoxy resin, wherein the formulation amount as the (e1) component is 0.1-10 wt.%.

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