Title:
モールド、及び樹脂シート
Document Type and Number:
Japanese Patent JP7287833
Kind Code:
B2
Abstract:
To provide a mold capable of suppressing insufficient filling of resin in a mold, insufficient curing of the resin, and occurrence of resin clogging on a mold surface when transferring an uneven structure of the mold surface to a resin surface.SOLUTION: A mold includes: an uneven surface with multiple protrusions formed by multiple grooves extending at crossing; a main uneven surface area; and an uneven surface area A where the deepest part of the groove is shallower than the deepest part of the main uneven surface area. The uneven surface area A occupies 50% or less of the entire uneven surface in a plan view.SELECTED DRAWING: Figure 3
Inventors:
Kazuhiko Noda
Katsuhiro Doi
Shintaro Futakami
Kyoko Sakurai
Katsuhiro Doi
Shintaro Futakami
Kyoko Sakurai
Application Number:
JP2019096073A
Publication Date:
June 06, 2023
Filing Date:
May 22, 2019
Export Citation:
Assignee:
Dexerials Corporation
International Classes:
B29C59/04; B29C33/42
Domestic Patent References:
| JP2013144381A | ||||
| JP2013202974A | ||||
| JP2011098443A | ||||
| JP2015072475A |
Foreign References:
| WO2013002048A1 | ||||
| CN104552914A | ||||
| US20100193997 |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Koji Kakinuma
Mitsutsugu Sugimura
Koji Kakinuma