Title:
ELECTROMAGNETIC RELAY
Document Type and Number:
Japanese Patent JP3130221
Kind Code:
B2
Abstract:
PURPOSE: To provide an electromagnetic relay which has a contact point frame united with a spool, whose contact mechanism can be composed highly precisely and at the same time simplified, and which can be miniaturized and assembled easily.
CONSTITUTION: Guide grooves 21b, 21c are formed in a through hole 21a of a contact point frame 21 formed unitedly with a spool 2 in the lower part and flat plate parts 84, 101 of fixed terminal pieces 8, 10 are inserted in the grooves mutually from reverse directions. A fixed a-contact point 9 and a fixed b-contact point 11 are installed in the flat plate parts 84, 101 and a movable contact point 7 attached to the tip end of a movable contact point spring 6 is set between the fixed contact points. A connection part 82 extended from the flat plate part 84 downward is formed in the fixed terminal piece 8 and an external terminal part 83 is formed through a supporting face part 81 having a horizontal face. The supporting face part 81 is brought into contact with a contact point frame 21 and the stress applied to the external terminal part 83 is supported on the contact point frame 21.
Inventors:
Hiroshi Ikeya
Application Number:
JP33712194A
Publication Date:
January 31, 2001
Filing Date:
December 26, 1994
Export Citation:
Assignee:
Hitech Co., Ltd.
International Classes:
H01H50/14; H01H50/44; (IPC1-7): H01H50/44; H01H50/14
Domestic Patent References:
| JP61176025A | ||||
| JP5250974A |
Attorney, Agent or Firm:
Hiroaki Saegusa
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