Title:
MOLDED MOTOR
Document Type and Number:
Japanese Patent JPS5872354
Kind Code:
A
Abstract:
PURPOSE:To improve the bonding strength of a molded motor by first mounting a bracket mounting plate on a housing when the bracket is bonded with an adhesive on the surface of the housing, and bonding the bracket on the plate with the adhesive. CONSTITUTION:When a bracket 4 is mounted on a housing 3, a bracket mounting plate 9 is first mounted by utilizing elasticity so that the surface 9a to be bonded is disposed at both sides of the housing 3. Then, the bracket 4 is bonded with an adhesive on the surface 9a to be bonded of the plate 9, and both brackets are coupled. In this manner, the brackets are rigidly and effectively bonded by the bonding of the metals of the plates without influence of mold releasing agent mixed in synthetic resin forming the housing.
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Inventors:
ICHIYANAGI KENJI
ASANO HOKAO
SASAKI YASUO
ASANO HOKAO
SASAKI YASUO
Application Number:
JP16985781A
Publication Date:
April 30, 1983
Filing Date:
October 22, 1981
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H02K3/44; H02K5/04; H02K5/08; (IPC1-7): H02K3/44
Attorney, Agent or Firm:
Toshio Nakao
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