Title:
MOLDED OPTICAL PANEL AND MOLDING DIE THEREOF
Document Type and Number:
Japanese Patent JP2003156633
Kind Code:
A
Abstract:
To easily manufacture a molding die to be used for molding an edge light panel in a short time.
A heat-resistant resin layer 3 is formed on the holding face of a molding substrate 1 by applying a polyimide resin and heating and hardening. The heat-resistant resin layer 3 is subjected to a dry etching means including process of forming a resist film 4, irradiating with UV rays to form a pattern, masking, plasma etching and dissolving with an etching solution to form a molding pattern 2 of the heat-resistant resin, which is used as the molding die for an edge light panel.
Inventors:
MURASE SHINZO
MATSUMOTO TAKAHIRO
TAYA SHUICHI
KONDO KENICHI
MATSUMOTO TAKAHIRO
TAYA SHUICHI
KONDO KENICHI
Application Number:
JP2001357884A
Publication Date:
May 30, 2003
Filing Date:
November 22, 2001
Export Citation:
Assignee:
STANLEY ELECTRIC CO LTD
International Classes:
G02B6/00; B23K26/21; G02F1/13357; (IPC1-7): G02B6/00; B23K26/00; G02F1/13357
Attorney, Agent or Firm:
Kota Tamura (1 person outside)
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