PURPOSE: To make gate residual length constant by holding a flat resin gate between a package main body and a resin gate to form a resin sump and concentrating stress to the boundary of the flat resin gate and the resin sump when the resin gate and the resin sump are removed to cut the flat resin gate.

CONSTITUTION: A cavity 24 forming the package main body of a miniature molded product is formed to the mating surface of an upper mold 21 and a lower mold 22 and a mold gate 25 becoming an introducing port pouring a molten resin in the cavity 24 is formed to the mating surface 23 of the lower mold. The cross-sectional shape of the mold gate 25 becomes fine as approaches the cavity 24 to be continued to a resin sump forming recessed part 27 and one end of the mold gate 25 is connected to the other end of the flat mold gate 26 with a thickness of 0.2mm, a width of 0.3mm and a length of 0.1mm connected to the side surface of the cavity 24. The length of the flat mold gate 26 is set to a resin gate residue standard, for example, 0.1mm or less.