Title:
MOLDING APPARATUS
Document Type and Number:
Japanese Patent JP3139961
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To transfer a previous molded article to a rear mold even if there is no runner to certainly position the same within the rear mold.
SOLUTION: A molding apparatus is constituted so that a movable mold main body 2 is fitted to a fixed mold main body 3 to form a front mold 101 and a rear mold 111. When a synthetic resin material is injected into the front mold 101, a previous molded article 91 is molded in the state attached to a holding pin. When the movable mold main body 2 is separated from the fixed mold main body 3 to rotate a rotary stand 20, the previous molded article 91 is transferred to the rear mold 111 and, when the movable mold main body 2 is fitted to the fixed mold main body 3, the previous molded article 91 is arranged within the rear mold 111. When a synthetic resin material is injected into the rear mold 111, the succeeding molded article 92 attached to the holding pin is molded and, when the movable mold main body 2 is separated from the fixed mold main body 3 and an ejection pin 68 is ejected, the succeeding molded article 92 is pulled out of the holding pin to be separated from the movable mold main body 2.
Inventors:
Kazunori Miura
Shoichi Inaba
Eijiro Yanagisawa
Shoichi Inaba
Eijiro Yanagisawa
Application Number:
JP14220396A
Publication Date:
March 05, 2001
Filing Date:
May 13, 1996
Export Citation:
Assignee:
Bandai Co., Ltd.
International Classes:
B29C45/26; B29C45/06; B29C45/14; (IPC1-7): B29C45/14; B29C45/06; B29C45/26
Domestic Patent References:
| JP9277305A |
Attorney, Agent or Firm:
Shuji Takada