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Title:
MOLDING COMPRISING SUGAR CHAIN POLYMER COMPOUND
Document Type and Number:
Japanese Patent JP2000327841
Kind Code:
A
Abstract:

To obtain a molding having sufficient mechanical strengths from a sugar chain polymer compound having both biodegradability and recyclability by using a composition prepared by dispersing a reinforcing filler in a sugar chain polymer compound.

A sugar chain polymer compound of the formula is used. In the formula, G is a sugar residue in which the hydroxyl groups not taking part in polymerization may be replaced by substituents; R is an optionally substituted aliphatic hydrocarbon group; and n is 1-5,000. The sugar chain polymer compound is obtained by dehydratively condensing a saccharide with an aliphatic dicarboxylic acid. The saccharide used is exemplified by an oligosaccharide or a monosaccharide. Among the oligosaccharides, maltose, lactose, and cellobiose are especially desirable, and among the monosaccharides, glucopyranose is particularly desirable. The reinforcing filler used is exemplified by a glass fiber or a carbon fiber. The amount of the reinforcing filter is desirably about 5-80 wt.% based on the total weight of the molding.


Inventors:
MINAMI MASATO
Application Number:
JP14352799A
Publication Date:
November 28, 2000
Filing Date:
May 24, 1999
Export Citation:
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Assignee:
CANON KK
International Classes:
C12N9/18; C08J5/00; C08K3/04; C08K7/06; C08K7/14; C08L5/00; C08L101/16; (IPC1-7): C08L5/00; C08J5/00; C08K3/04; C08K7/06; C08K7/14
Attorney, Agent or Firm:
Katsuhiro Yoshida (1 person outside)