MOLDING DIE AND MANUFACTURE THEREOF - Apic Yamada Co., Ltd.

Title:

MOLDING DIE AND MANUFACTURE THEREOF

Document Type and Number:

Japanese Patent JP3304520

Kind Code:

B2

Abstract:

PURPOSE: To provide a molding die capable of molding a lead frame of multi-pin having no dam bar with resin assuredly and easily.
CONSTITUTION: A molding die is provided for molding with resin a lead frame 10 having no dam bar and is provided with dam blocks 18 formed in positions between the leads of the lead frame 10 in accordance with a lead pattern. The dam blocks 18 are formed by electro-discharge machining with an electrode formed by etching process in accordance with a lead pattern of an outer lead 16.

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Inventors:

Ryuzen Yamaguchi

Application Number:

JP19449893A

Publication Date:

July 22, 2002

Filing Date:

August 05, 1993

Export Citation:

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Assignee:

Apic Yamada Co., Ltd.

International Classes:

B29C33/38; B29C45/02; B29C45/14; B29C45/26; H01L21/56; B29K105/20; B29L31/34; (IPC1-7): B29C45/26; B29C33/38; B29C45/14; H01L21/56

Domestic Patent References:

JP55123441A

Attorney, Agent or Firm:

Takao Watanuki (1 outside)

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