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Patent Searching and Data


Title:
MOLDING METHOD OF MULTI-LAYER PARISON
Document Type and Number:
Japanese Patent JPS6149808
Kind Code:
A
Abstract:

PURPOSE: To mold a multi-layer parison whose interlaminar adhesion properties are favorable, by a method wherein an inner and outer surface layers and a core ingredient are formed respectively by one side and the other side ingredients to be injected within a cavity for molding the same parison.

CONSTITUTION: A cavity mold 1, neck mold 2 and core 3 are clamped and a cavity 4 which is in the same shape as a multi-layer parison P is formed. When first molten resin 5 is injected into the cavity 4 by an injection device 7 through a directional control valve 6, a part of the cavity 4 which has brought into contact with said wall surface and meets with film resistance by the wall surface hardly moves. Then if the inside of the cavity 4 is filled with the molten resin through control of specified quantities of the first and second molten resin when the second molten resin 8 is injected by the injection device, the multi-layer parison P whose materials of the inner and outer surface layer 10 and core 11 are different from each other can be formed.


Inventors:
TSUTSUI SADAHARU
Application Number:
JP17078784A
Publication Date:
March 11, 1986
Filing Date:
August 16, 1984
Export Citation:
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Assignee:
SUMITOMO HEAVY INDUSTRIES
International Classes:
B29B11/08; B29C45/16; B29C49/06; (IPC1-7): B29B11/08; B29C45/16; B29C49/06; B29L9/00; B29L22/00
Domestic Patent References:
JPS57128520A1982-08-10
JPS57128516A1982-08-10
Attorney, Agent or Firm:
Toshi Hisamon