Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOLDING METHOD OF SMC PANEL
Document Type and Number:
Japanese Patent JPS6174813
Kind Code:
A
Abstract:

PURPOSE: To improve shock strength and to constitute the titled panel so that a matter wherein mechanical strength of the panel is deteriorated and the panel is short of rigidity is not generated, by performing compression molding by arranging an SMC material wherein glass filaments are dispersed favorably at the time of compression molding within a mold so that the same is positioned around the other SMC material.

CONSTITUTION: At the time of charge of an SMC material into a mold at the time of molding of the SMC panel by making use of the SMC material A to be obtained by making use of a glass fiber for which a binder which is inferior in styrene solubility is used to attach importance to surface smoothness and rigidity and a SMC material B to be obtained by making use of a glass fiber for which a binder whose styrene solubility is high is used by attaching importance to shock resistance, two kinds of the SMC materials are charged onto the mold so that the external circumference of the material A is surrounded by the material B centering around the material A.


Inventors:
TASHIRO HIROSHI
Application Number:
JP19814784A
Publication Date:
April 17, 1986
Filing Date:
September 21, 1984
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NISSAN MOTOR
International Classes:
B29C43/20; B29K105/12; B29L9/00; B29L31/30; (IPC1-7): B29C43/20; B29K105/12; B29L9/00; B29L31/30
Attorney, Agent or Firm:
Akihiro Onishi