Title:
MOLDING METHOD
Document Type and Number:
Japanese Patent JP3668864
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To mold a thin-walled molding or of a medium- or small-scaled molding, without a large pressure loading.
SOLUTION: A molding material, which adheres to the molding surface of a first mold 20 vibrated by being applied with ultrasonic vibrations through the contact with a liquid molding material, is molded by the first mold 20 and a second mold 21 through the registering of the first mold 20 and the second mold 21, in which the above vibration is kept unchanged. Since a melted molding material is attracted and adheres to the first mold 20 through the vibration due to the ultrasonic vibration, a molding becomes possible through a small pressure loading caused by the first mold 20 and the second mold 21.
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Inventors:
Yuichi Furukawa
Yoshiki Tsunekawa
Yoshiki Tsunekawa
Application Number:
JP4215099A
Publication Date:
July 06, 2005
Filing Date:
February 19, 1999
Export Citation:
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA
International Classes:
B22D18/02; B22D27/08; B22D27/11; B29C31/04; B29C43/02; B29C43/34; (IPC1-7): B22D18/02; B22D27/08; B29C31/04; B29C43/34
Domestic Patent References:
| JP2003326356A | ||||
| JP2003326352A | ||||
| JP2003340563A | ||||
| JP2099261A | ||||
| JP5329613A | ||||
| JP6134566A |
Attorney, Agent or Firm:
Hiroshi Okawa