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Title:
MOLDING OF MONOMOLECULAR ADSORPTION BUILT-UP FILM
Document Type and Number:
Japanese Patent JPH029478
Kind Code:
A
Abstract:

PURPOSE: To mold a stable disacetylene monomolecular adsorption built-up film by forming a silane monomolecular adsorption film on any substrate and allowing an aliphatic monomolecular film to be coupled to the monomolecular adsorption film using an oxidation coupling reaction method.

CONSTITUTION: A silane surfactant with an acetylene bond in a molecule is allowed to undergo reaction, using a chemical adsorption method, on an Si substrate 1 with SiO2 formed on the surface to form a monomolecular adsorption film 2. Next, a long-chain aliphatic acid with an acetylene bond in the molecule is allowed to undergo reaction on the monomolecular adsorption film 2 using an oxidation coupling method to form a built-up film 5 as the second layer. Thus, for instance, a diacetylene bond 6 is formed on the surface of the adsorption film 2. Again the silane surfactant is allowed to undergo on the surface of the built-up film 5 to form a built-up film 8 as the third layer with the help of a chemical adsorption method. After this, if an energy ray 11 such as far ultraviolet ray is cast to the whole surface of the built-up film, the diacetylene bonds 6 are polymerized with the adjacent other and subsequently, a highly stable diacetylene monomolecular adsorption built-up film is formed.


Inventors:
TAMURA HIDEJI
OGAWA KAZUFUMI
Application Number:
JP16006188A
Publication Date:
January 12, 1990
Filing Date:
June 28, 1988
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B05D1/20; C09K3/00; H01L51/05; H01L51/40; (IPC1-7): B05D1/20; C09K3/00; H01L29/28
Attorney, Agent or Firm:
Akira Kobiji (2 outside)