成形用樹脂組成物及び電子部品装置

Title:

成形用樹脂組成物及び電子部品装置

Document Type and Number:

Japanese Patent JP2024075422

Kind Code:

A

Abstract:

【課題】低い誘電正接及び低い誘電率を有する硬化物を成形可能で離型性に優れる成形用樹脂組成物の提供。【解決手段】成形用樹脂組成物は、硫黄原子含有型エポキシ樹脂と、活性エステル化合物と、離型剤と、無機充填材とを含有する。【選択図】なし

Inventors:

Mika Tanaka
Yuma Takeuchi
Yuta Sukegawa
Shintaro Okada

Application Number:

JP2022186880A

Publication Date:

June 03, 2024

Filing Date:

November 22, 2022

Export Citation:

Assignee:

Resonac Co., Ltd.

International Classes:

C08G59/30; H01L23/29; H01Q1/40

Attorney, Agent or Firm:

Patent Attorney Corporation Taiyo International Patent Office

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