Title:
MOLDING STRUCTURE OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2000059013
Kind Code:
A
Abstract:
To provide a molding structure by a method, wherein terminal electrodes are not covered with a resin during the molding.
Terminal electrodes 4 are provided on the outer periphery of a printed substrate 1. The circuit parts 2 mounted on the substrate 1 are covered with a molding resin 3 to constitute a surface package structured electronic component. At this time, the conductor patterns 5 are provided on a side lower than the surface where on the molding resin 3 is applied. Moreover, the conductor patterns 5 and the conductor patterns 5a on the surface of the printed substrate 1 are connected by a through-hole.
Inventors:
KOBAYASHI KAZUMI
TAKAHASHI MASAMI
OZAKI YUMIKO
AKACHI YOSHIAKI
TAKAHASHI MASAMI
OZAKI YUMIKO
AKACHI YOSHIAKI
Application Number:
JP22214198A
Publication Date:
February 25, 2000
Filing Date:
August 05, 1998
Export Citation:
Assignee:
TDK CORP
International Classes:
H05K3/28; H01L25/04; H01L25/18; H05K1/11; (IPC1-7): H05K3/28; H01L25/04; H01L25/18; H05K1/11
Attorney, Agent or Firm:
Shoichi Wakata
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