Title:
MOLECULARLY ORIENTED SYNTHETIC RESIN AND CLAD THEREOF
Document Type and Number:
Japanese Patent JP2002308936
Kind Code:
A
Abstract:
To obtain a synthetic resin composition exhibiting satisfactory thermal adaptability to a substrate.
The synthetic resin composition comprises a network polymer having a linear thermal expansion coefficient in two mutually perpendicular directions below the glass transition temperature at least three times smaller than that in a third direction extending perpendicularly to these two directions and having a helical orientation having a helical axis in the same direction as the third direction.
Inventors:
HEYNDERICKX INGRID E J R
BROER DIRK J
MOL GRIETJE N
BROER DIRK J
MOL GRIETJE N
Application Number:
JP2002006171A
Publication Date:
October 23, 2002
Filing Date:
October 16, 1990
Export Citation:
Assignee:
KONINKL PHILIPS ELECTRONICS NV
International Classes:
G02B6/12; C08F20/30; C08F299/02; C08J3/00; C08J5/00; C08L33/04; C08L101/00; C09K19/38; G02B1/04; G02B5/26; G02B5/30; G02B6/00; G02F1/00; (IPC1-7): C08F20/30; C08J5/00; G02B1/04; G02B5/26; G02B5/30; G02B6/12
Attorney, Agent or Firm:
Susumu Tsugaru