Title:
MOTHER BOARD REPLACEMENT METHOD
Document Type and Number:
Japanese Patent JP2003116156
Kind Code:
A
Abstract:
To provide an efficient mother board replacement method for an automatic main distribution panel device.
The method for replacing a mother board contained in the Main Distribution Frame includes a connection pin data extract step of; extracting cross points of connection pins to be inserted to a matrix board placed on a faulty mother board as connection pin data; and a mother board manufacturing step of manufacturing a replacement purpose mother board on the basis of the connection pin data to replace the faulty mother board. Thus, the connection pin data are extracted in this way and the replacement purpose mother board can efficiently be manufactured on the basis of the data.
Inventors:
YAMADA MASAMI
ABE TAKASHI
MORIMURA ATSUSHI
ABE TAKASHI
MORIMURA ATSUSHI
Application Number:
JP2001308139A
Publication Date:
April 18, 2003
Filing Date:
October 04, 2001
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
OKI COMTEC LTD
OKI COMTEC LTD
International Classes:
H04Q1/04; (IPC1-7): H04Q1/04
Attorney, Agent or Firm:
Takashi Ogaki
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