PURPOSE: To enable the attachment of the heat radiation means of a monolithic IC inside a case by making a three-phase inverter into a monolithic IC inclusive of the peripheral circuit, and storing it inside the case together with a sensor and an amplifier.
CONSTITUTION: A semicircular printed wiring board 25, to the supports 21A and 21B of a stotor core, and, in opposition to this printed wiring board 25, a semicircular heat radiation plate 41 consisting of aluminum, to supports 21B and 21E, are fixed. The printed wiring board 25 mounts Hall elements 7A, 7B and 7C and a sensor amplifier 8, to which these outputs are supplied, and mounts a monolithic IC 40, which is integrated inclusive of a three-phase inverter 15' and its peripheral circuit, so that the heat sink at the rear may stick fast to a heat radiating plate 41. Hereby, the number of parts mounted on the printed wiring board and the possession area can be reduced. and by that amounts the heat radiation means for the monolithic IC can be provided, and the output capacity of a motor can be increased.
ISHII MAKOTO
KAWAGUCHI YUJI
