PURPOSE: To realize an assembling method capable of simply obtaining high quality solder bond, in an assembling method wherein surface mount devices and insertion mount devices are mixedly mounted and connected on the same printed board.
CONSTITUTION: In a printed board wherein surface mount devices and insertion mount devices are mixedly mounted on a copper through hole board subjected to preflux treatment, the following process is provided; after reflow soldering is finished, and before postflux coating process, preflux which has become hard to be fused as the result of reflow sodering heat is washed and eliminated. Thereby postflux directly acts on a copper circuit on the board surface, and high quality solder bond can easily be obtained.
URABE TOSHIO
MUTOU RIYOUJI
HAMAMI ISAO
