Title:
ICチップ上への電子部品の実装
Document Type and Number:
Japanese Patent JP4811437
Kind Code:
B2
Abstract:
The objective of this invention is to provide an assembling method for electronic members characterized by the fact that electronic members can be joined reliably and easily without using solder paste. The semiconductor device of the present invention has the following parts: silicon substrate 100 with circuit elements formed on it, plural protrusion-shaped metal electrodes 110A, 110B formed on silicon substrate 100, and capacitor 140 having Au-plated electrodes 142, 144. The electrodes 142, 144 of capacitor 140 are metallurgically joined to protrusion-shaped metal electrodes 110A, 110B by means of ultrasonic thermo-compression bonding.
Inventors:
Shinichi Togawa
Masumoto Mutsu
Masumoto Mutsu
Application Number:
JP2008206669A
Publication Date:
November 09, 2011
Filing Date:
August 11, 2008
Export Citation:
Assignee:
Texas Instruments Japan Ltd.
International Classes:
H01L25/00; H01L21/607
Domestic Patent References:
| JP2007243229A | ||||
| JP2002184812A | ||||
| JP2002184933A | ||||
| JP7086491A |