PURPOSE: To obtain an LSI package, cost thereof is low, by mounting an electronic part under the state in which it is hung to an outer frame by a support lead.
CONSTITUTION: Aluminum or gold films are formed to wire fitting sections at the noses of each lead 8 of a lead frame 15. A support plate 4 on which a heat sink 14 is fixed is fastened to a second package 3 by using a reinforcing plate 6 and low melting-point frit glass of high reliability. A pellet 11 is fixed to the support plate 4 through an Au layer partially formed to a section, to which the pellet is mounted, of the support plate. An electrode for the pellet and the leads are connected electrically through a wire bonding. A first package 1 is superposed on the second package 3 through low melting-point glass frit, and sealed integrally in an airtight manner through heating and melting. The surfaces of the leads 8 projecting from a package section 10 are plated with solder. Only the leads 8 are cut at the root sections of a rim 16.
HOSOSAKA HIROSHI
MIYAMOTO MITSUO
USAMI TAMOTSU
KAWADA KENRIYOU
| JPS474118A |