PURPOSE: To eliminate the damage of a semiconductor chip mounted substrate as to a device which is so constituted that a semiconductor chip mounted on a substrate is covered with a frame, specially, a method for the facedown mounting of a semiconductor chip on a liquid crystal display panel.

CONSTITUTION: The frame 13 which has a through hole 14 bored at a necessary part is mounted on the semiconductor chip mounted substrate 11 and then the semiconductor chip 5 is mounted on the semiconductor chip mount part of the substrate 11 which is exposed through the through hole 14. The semiconductor chip 5 or the semiconductor chip 5 and through hole 11 are sealed with resin 15 or the through hole 14 is closed with a lid plate 16 if necessary.