Title:
マウント方法
Document Type and Number:
Japanese Patent JP4087003
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To certainly place a tape body on an adhered matter by providing a placing portion for placing the tape body transported onto a surface having a ventilation hole, a head portion for sucking the tape body, and a blowing means for blowing gas through the ventilation hole, and pressurizing the tape body with the blowing means in the separating direction from the placing portion. SOLUTION: A plurality of tape-shaped metal foils are fed by a feed roll into a groove 20 of a drag 15 until it abuts to a stopper 21 restricted in a prescribed length. A cutter 14 is driven, one side surface of a cutting edge 14b slidably abuts to an end surface of the drag 15, and the metal foils are cut in the prescribed length, are loaded in the groove 20 of the drag 15, are pressed by a pressing portion 30 of a cope 25, and are molded by press to a desired shape. The metal foils are sucked to the cope 25 due to sucking force of a vacuum pump from a sucking hole of the pressing portion 30, are separated from each other by air blown from a ventilation hole in the drag 15, and therefore, are sucked to the cope 25 to be placed on a substrate. Molding and sucking are simultaneously performed to improve productivity.
Inventors:
Matsuyoshi Masahiro
Masakazu Endo
Masakazu Endo
Application Number:
JP7151599A
Publication Date:
May 14, 2008
Filing Date:
March 17, 1999
Export Citation:
Assignee:
Sony Chemical & Information Device Co., Ltd.
International Classes:
B30B15/32; H05K13/04; H01M2/34
Domestic Patent References:
| JP10064951A | ||||
| JP4240082A |
Attorney, Agent or Firm:
Akira Koike
Eiichi Tamura
Seiji Iga
Eiichi Tamura
Seiji Iga