To prevent the deterioration in electric characteristics caused by the cracks generated on a ceramic sintered body when the terminal electrode of an electronic part is mounted on a substrate by soldering and also when cracks are grown when the temperature changes repeatedly.

When the terminal electrode 3 of a ceramic electronic part 1, having a terminal electrode 3 on both edges of a ceramic sintered body 2, is to be mounted on a substrate 4 using solder 6 so that the ratio (l/L) of the length l of one-side terminal electrode forming part in longitudinal direction of the ceramic sintered body 2 against the total length L of the ceramic sintered body 1 may be 0.18 to 0.35, and the ratio (h/H) of the height h of the connection part between the terminal electrode 3 and the solder 6 against the thickness H of the ceramic sintered body may be 0.7 or smaller. Desirably, at least the corner part of the edge face, where the terminal electrode of the ceramic sintered body 2 is formed, is formed in a curved shape.