PURPOSE: To facilitate soldering of an electronic component and to contrive the improvement of the quality of the component and the cost reduction of the component by a method wherein the mounting structure of the electronic component is constituted into a such a structure that a support pattern is formed of a dummy pattern provided on the surface of a substrate, a solder resist laminated on the upper layer of the dummy pattern and a masking, which is further laminated on the upper layer of the solder resist.

CONSTITUTION: A mounting structure of an electronic component 3 is a structure, wherein the component 3 is mounted on a substrate 1 by securing by soldering terminals 4 formed on the bottom 3A of the component 3 on pads 2 provided on the surface 1A of the substrate 1. That is, the mounting structure is constituted into such a structure that when a prescribed terminal 4 is made to correspond to a prescribed terminal 2 and the component 3 is pressed on the surface 1A of the substrate 1, a support pattern 5 to support a plurality of places of the bottom 3A of the component 3 is provided on the surface 1A of the substrate 1 in such a way that prescribed intervals S parallel to each other are held between the termianls 4 and the pads 2 and moreover, the pattern 5 is formed of a dummy pattern 6, a solder resist 7 and a marking 8.