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Patent Searching and Data


Title:
MOUNTING STRUCTURE OF ELECTRONIC PART
Document Type and Number:
Japanese Patent JPH06334297
Kind Code:
A
Abstract:

PURPOSE: To make it possible to reduce stress exerted on electronic parts due to camber in a circuit board on which the parts are mounted, and thus prevent cracking of the parts.

CONSTITUTION: External electrodes 2 and 3 are formed on both ends of the mounting face of an electronic part 1a; at least one of the electrodes is extended toward the center of the part, and the electrodes 2 and 3 are insulated from each other. Lands 4 are formed on a circuit board such that the distance between them will be in accordance with that between the external electrodes 2 and 3 of the electronic part 1. The ends of the external electrodes 2 and 3 positioned in the center of the part in the direction of width, are connected and bonded to the respective lands 4. This reduces the distance between points at which an electronic part 1 is bonded to a circuit board. This reduces stress exerted on the electronic part 1 due to camber in the circuit board on which the part is mounted, and prevents external electrodes of the part from peeling off and the part from cracking.


Inventors:
KITAJIMA TAKAMICHI
Application Number:
JP11837693A
Publication Date:
December 02, 1994
Filing Date:
May 20, 1993
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
H05K1/18; H05K1/11; H05K3/34; (IPC1-7): H05K1/18