Title:
高周波機器の取付構造
Document Type and Number:
Japanese Patent JP4500726
Kind Code:
B2
Abstract:
In a mounting structure of a high frequency apparatus, in an outer circumference around terminals connected to a mother board, an enclosed portion, which is brought into contact with the mother board and is enclosed by a ring-shaped convex portion provided in a cover, or an enclosed portion, which is brought into contact with the mother board and is enclosed in a ring shape by a convex portion provided in the cover and extending portions from the frame, are provided. The terminals are electrically shielded by the enclosed portion. Therefore, when a high frequency apparatus is mounted on the mother board, interfering electric waves are prevented from entering into the terminals, and thus favorable performance is obtained.
Inventors:
Daisuke Inoue
Chiba Shigeto
Imairei Holy
Chiba Shigeto
Imairei Holy
Application Number:
JP2005124281A
Publication Date:
July 14, 2010
Filing Date:
April 21, 2005
Export Citation:
Assignee:
ALPS ELECTRIC CO.,LTD.
International Classes:
H05K9/00
Domestic Patent References:
| JP7086786A | ||||
| JP7022541A | ||||
| JP2004273721A | ||||
| JP2000294973A | ||||
| JP7045985A | ||||
| JP10041667A | ||||
| JP2005108881A | ||||
| JP2004253462A | ||||
| JP5062095U | ||||
| JP4126430U |
Attorney, Agent or Firm:
Takahiro Yamazaki
Kenji Tsuboi
Kenji Tsuboi