To provide a mounting structure for an imaging device module the thickness and the component mounting area of which are reduced in order to realize a low profile and miniaturizing more than those of a conventional imaging device module.

The mounting structure is configured such that the imaging device module 2 is mounted on an uppermost end of a main board 10 in one case of a mobile telephone 1. A lens 5 of the imaging device module 2 is fitted to a lens attachment section 7a of a holder 7, an imaging device 6 and an IC 3 are mounted on a flexible printed circuit board 3, which is folded in three and fitted to a flexible printed circuit board container section 7b of a holder 7b. The tip of the flexible printed circuit board 3 is inserted to an FPC(Flexible Printed Circuit) connector mounted on the main board 10 to make electric connection between the main board and the flexible printed circuit board 3. Thus, the thickness of the mobile unit such as a mobile telephone can be made thin.