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Patent Searching and Data


Title:
MOUNTING STRUCTURE FOR THERMOCOMPRESSION-BONDED TERMINAL
Document Type and Number:
Japanese Patent JPH06232525
Kind Code:
A
Abstract:

PURPOSE: To obtain a mounting structure for a thermocompression-bonded terminal on which the cutting of the conductor wire, constituting the flexible printed board and the like on the connection part which is the weak point of the thermocompression-bonding method heretofore in use in connection of two connecting objective substances using a flexible printed board or a flexible flat cable, is prevented.

CONSTITUTION: In this thermocompression-bonded structure with which an electrode 2 and a conductor wire are electrically connected by thermocompression bonding of a flexible board 5, which is formed by coating a resin layer on the circumference of the conductor wire, on the electrode 2 arranged along the edge of a printed substrate 1, the resin 6 where the above- mentioned thermocompression bonding is performed does not include the edge of the electrode on the above-mentioned electrode, and also the area of the part 6a, where the electrode of the outside of the electrode row is not present, is made wider.


Inventors:
AMANO KAZUYUKI
Application Number:
JP3954593A
Publication Date:
August 19, 1994
Filing Date:
February 03, 1993
Export Citation:
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Assignee:
TOYO COMMUNICATION EQUIP
International Classes:
H01R4/02; H05K1/14; H05K3/36; (IPC1-7): H05K1/14; H01R4/02; H01R9/07; H01R9/09
Attorney, Agent or Firm:
Suzuki Hitoshi